Electroplating Design - Tanzania
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Resists f. Electroplating
steep sidewalls up to 150 µm, max. adhesion & stability for Au, Cu, Ni
Powder Coating & Plating
Anodize,Chem Film, Mil Spec Paint for auto, computers, metal & more
MEMS Plating Processes
Leading supplier of Semiconductor Chemistry/Equipment -Cu, Au, Sn etc
Silver Plating Powder
Eliminate Oxidation/Lasting Protect On-The-Job, Instant Use, Run Cool
Leading Plating Company
Anodize, Nickel, Tin, Aluminum, etc Quick And Professional Service.
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